Microstructure and thermal conductivity of  submicron Si3N4 reinforced 2024Al composite

YANG Wen-shu(杨文澍), XIU Zi-yang(修子扬), CHEN Guo-qin(陈国钦), WU Gao-hui(武高辉)

Transactions of Nonferrous Metals Society of China ›› 2009, Vol. 19 ›› Issue (Special 2) : 378-381.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2009, Vol. 19 ›› Issue (Special 2) : 378-381.
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Microstructure and thermal conductivity of  submicron Si3N4 reinforced 2024Al composite

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2009, 19(Special 2): 378-381

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